HOT ire USB 3.0 n'akụkụ ntinye ego

ỌRỤ na-ekpo ọkụ USB 3.0 ego ntinye ego egosipụtara

Nkọwa dị mkpirikpi:

Nkọwa ngwaahịa

Aha ihe: ego ntinye akụkụ USB 3.0

Ọkwa: DC 30V 0.2A

Mkpuchi mkpuchi: ≥1000mΩ min.500V DC

Ike dielectric: 250V AC maka 1 min

Nguzogide kọntaktị: ≤50mΩ

Ike ntinye: ≤35N

Ike mmịpụta: ≥10N

Ojiji:

A na-eji ya eme ihe na ụlọ ọrụ dị elu, dị ka ngwaahịa igwefoto dijitalụ, ngwa kọmputa, ihe egwuregwu ụmụaka, ekwentị mkpanaaka nchaji interface na ngwaahịa ndị ọzọ kwesịrị ịkwụ ụgwọ.

Zitere anyị email

Nkọwa ngwaahịa

Mkpado ngwaahịa

Uru ngwaahịa: nnyefe ngwa ngwa, ihe nlele n'efu, ngwaahịa nwere asambodo RoHS, usoro ịre ahịa laser, ndụ okirikiri karịa oge 300000, ọrụ azụmaahịa mgbe emechara, nkwado teknụzụ na omume ọma

Ngwa ubi: Kọmputa USB mpụga ọdụ ụgbọ mmiri, Nchaji akụrụngwa, Ngwa na akụrụngwa, n'ji ngwá electronic, ngwa ụlọ, nchekwa ngwaahịa

Ike ụlọ ọrụ: na afọ 13 nke ahụmịhe ụlọ ọrụ, ụlọ ọrụ ahụ agafeela asambodo ISO9001, ọtụtụ asambodo patent, karịa ndị ahịa 5300 na-arụkọ ọrụ ọnụ, ọtụtụ ndị ahịa nke ụlọ ọrụ edepụtara, ndị ọrụ 106, 12 ngwaike punches, 18 injection ịkpụzi igwe, 26 zuru- igwe mgbakọ akpaaka, igwe nnwale 32 zuru akpaka, igwe nnwale 21 ọkara akpaaka, igwe nyocha ndụ 12 na ngwa nnwale 25 ndị ọzọ.

Uru ngwaahịa: nnyefe ngwa ngwa, ihe nlele n'efu, ngwaahịa nwere asambodo RoHS, usoro ịre ahịa laser, ndụ okirikiri karịa oge 300,000, ọrụ azụmaahịa mgbe emechara, nkwado teknụzụ na ezigbo ọrụ

Ngwa ubi: Kọmputa USB mpụga ọdụ ụgbọ mmiri, Nchaji akụrụngwa, Ngwa na akụrụngwa, n'ji ngwá electronic, ngwa ụlọ, nchekwa ngwaahịa

Nkọwapụta:

Eletriki:

1.Ngosipụta ugbu a: 1.5A / kọntaktị ọnụ

2.Voltaji Rating: 30V DC

3.Contact Resistance: 30 milliohms MAX

4.Dielectnic na-eguzogide voltaji: 500 V AC AT oké osimiri Levol

5.Mgbochi mkpuchi: 1000MEGA ohms MIN

6.Cnnector Mate na Unmate Force

Ike ike: 3.57kgf (MAX)

Ike enweghị ike: 1.02kgf (MlN)

7. Njide njedebe: 1.0kgf (MIN)

8.Housing: Hing okpomọkụ Tnermaplastics,

9.Contact: Copper Alloy C2680

10.Shell: Copper Alloy C2680/SPCC

11. N'ikpeazụ:

1.Contact:Piated Gold na Mating Area;Tin On Solder Tolls

Na-etinye 50U “(MIN) gbamgbam gburugburu ọnụ ọnụ, Mpaghara nwere ọla edo 100-200U” 1U nwere ọla edo

Shell: A na-eji tin 80U “(MIN) kpuchie shei ọla kọpaỌkọlọtọ ikuku: Ọ gwụla ma ọbụghị na akọwapụtaghị ụkpụrụ ikuku ikuku maka ịme nha na ule dị ka ndị a:(1) N'etiti Ahụ na Onye Nduzi: 5ºC ruo 35℃
(2) N'etiti NDỤMỌDỤ AGAGHỊ Kpọtụrụ:45% ruo 85%

(3) NSOGBU:86Kpa TO 106Kpa

Nnwale SOLDERA BILITY: A ga-agbanye n'elu ọdụ ụgbọ mmiri 1mm n'ime ebe ịsa ahụ nke 250.±5℃Maka 5±0.5 sekọnd

Iguzogide Nnwale Ọkụ Ọkụ:

ỌNỌDỤ NKE NKWUKWU:

PRESET: Okpomọkụ dị n'elu ala ọla kọpa kwesịrị iru 180 .120℃S MGBE PCB batara n'ime ihe eji ere ahịa.

Okpomọkụ kacha ogologo: Okpomọkụ dị n'elu ala ọla kọpa kwesịrị iru ogo okpomọkụ nke 260±5 N'ime sekọnd iri abụọ.℃

Uzo esi eji igwe eji eme ihe: BIT TEMPERATURE 330±5℃OGE mbinye ego nke IRON3±0.5 SEC agbanyeghị na oke nrụgide agaghị etinye na njedebe.